Table Top manual Wire Bonders Machine – Best Value For Money!
by Micro Point Pro
(former K&S Wire Bonder product line)
Our product stands as a global leader in the fields of research, civilian applications, military use, medical advancements, along with various other sectors.
We are committed to deliver best in class product & application support
Leave details for a free consultation for the most suitable machine for you and get the most tailored solution.
With over 40 years of wire bonding experience, the current range of MPP (formerly K&S) manual wire bonder’s includes the i5000 Ball Bonder, i5000 Wedge Bonder, and i5000 Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities based on the proven 4500 Series, the market leader for nearly a decade.
The equipment is used for process development, production, or research of microelectronic and related device interconnect for Universities, R&D centers, and small production applications.
The systems provide excellent ease of use, high yield, optimum bond quality, and repeatability, plus the reliability needed for the most challenging bonding applications.
Over 40 years of wire bonding experience
Install base of 9000+ machines worldwide
Global support & service
Customized wire bonding profiles
Short delivery time
Availability of used & refurbished machines
Overall product-application-bonding tools support
Tailored purchase agreements (including Trade-In & Rental options).
In 2016, Micro Point Pro Ltd (MPP) acquired from Kulicke and Soffa (K&S) the business unit that designs and manufactures Manual Wire Bonders for Universities, R&D centers, and small production applications.
Since then MPP is a world OEM leader in the Manual Wire Bonders industry with our state-of-the-art products and excellent global support.
Leave details for a free consultation for the most suitable machine for you and get the most tailored solution.
All rights reserved 2024 (c) Micro Point Pro Ltd.